|
|
|
| 51 |
5,633,047 |
Electronic devices having metallurgies containing copper-semiconductor
compounds
|
| 52 |
5,563,583 |
Multibit magnetic radio frequency tag using micromechanics
|
| 53 |
5,554,974 |
Encodable tag with radio frequency readout
|
| 54 |
5,528,222 |
Radio frequency circuit and memory in thin flexible package
|
| 55 |
5,266,520 |
Electronic packaging with varying height connectors
|
| 56 |
5,239,447 |
Stepped electronic device package
|
| 57 |
5,189,363 |
Integrated circuit testing system having a cantilevered contact lead
probe pattern mounted on a flexible tape for interconnecting an
integrated circuit to a tester
|
| 58 |
5,173,763 |
Electronic packaging with varying height connectors
|
| 59 |
5,134,460 |
Aluminum bump, reworkable bump, and titanium nitride structure for tab
bonding
|
| 60 |
4,970,579 |
Integrated circuit package with improved cooling means
|
| 61 |
4,862,322 |
Double electronic device structure having beam leads solderlessly bonded
between contact locations on each device and projecting outwardly from
therebetween
|
| 62 |
4,851,767 |
Detachable high-speed opto-electronic sampling probe
|
| 63 |
4,814,855 |
Balltape structure for tape automated bonding, multilayer packaging,
universal chip interconnection and energy beam processes for
manufacturing balltape
|
| 64 |
4,498,046 |
Room temperature cryogenic test interface
|
