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| 1 |
8,441,121 |
Package carrier and manufacturing method thereof
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| 2 |
8,436,465 |
Semiconductor device and method for manufacturing the semiconductor device
|
| 3 |
8,427,833 |
Thermal power plane for integrated circuits
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| 4 |
8,421,235 |
Semiconductor device with heat spreaders
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| 5 |
8,421,220 |
Silicon based microchannel cooling and electrical package
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| 6 |
8,421,219 |
Semiconductor component having adhesive squeeze-out prevention
configuration and method of manufacturing the same
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| 7 |
8,421,217 |
Achieving mechanical and thermal stability in a multi-chip package
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| 8 |
8,415,787 |
Integrated circuits having interconnects and heat dissipators based on
nanostructures
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| 9 |
8,415,204 |
Integrated circuit packaging system with heat spreader and method of
manufacture thereof
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| 10 |
8,409,920 |
Integrated circuit package system for package stacking and method of
manufacture therefor
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| 11 |
8,405,214 |
Semiconductor package structure with common gold plated metal conductor on
die and substrate
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| 12 |
8,399,985 |
Mold design and semiconductor package
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| 13 |
8,395,255 |
Semiconductor device having a cooling function component
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| 14 |
8,395,254 |
Integrated circuit package system with heatspreader
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| 15 |
8,391,011 |
Cooling device
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| 16 |
8,391,008 |
Power electronics modules and power electronics module assemblies
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| 17 |
8,390,112 |
Underfill process and materials for singulated heat spreader stiffener for
thin core panel processing
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| 18 |
8,384,212 |
Semiconductor equipment and method of manufacturing the same
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| 19 |
8,379,389 |
Display panel and image display apparatus
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| 20 |
8,373,267 |
Electrostatic discharge (ESD) silicon controlled rectifier (SCR) structure
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| 21 |
8,368,208 |
Semiconductor cooling apparatus
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| 22 |
8,368,206 |
Heat radiation package and semiconductor device
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| 23 |
8,367,478 |
Method and system for internal layer-layer thermal enhancement
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| 24 |
8,367,469 |
Chip-scale semiconductor die packaging method
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| 25 |
8,363,407 |
Electronic device
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| 26 |
8,351,210 |
Electronic apparatus
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| 27 |
8,350,263 |
Semiconductor package, method of evaluating same, and method of
manufacturing same
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| 28 |
8,338,943 |
Semiconductor package with thermal heat spreader
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| 29 |
8,338,940 |
Semiconductor device
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| 30 |
8,335,083 |
Apparatus and method for thermal management using vapor chamber
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| 31 |
8,335,077 |
Insulating aperture in printed circuit boards
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| 32 |
8,331,094 |
Thermal and power bus stacked package architecture
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| 33 |
8,330,269 |
Semiconductor device and method
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| 34 |
8,329,581 |
Microelectronic packages and methods therefor
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| 35 |
8,324,723 |
Semiconductor chip assembly with bump/base heat spreader and dual-angle
cavity in bump
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| 36 |
8,324,720 |
Power semiconductor module assembly with heat dissipating element
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| 37 |
8,315,056 |
Heat-radiating substrate and method of manufacturing the same
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| 38 |
8,310,067 |
Ball grid array package enhanced with a thermal and electrical connector
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| 39 |
8,310,045 |
Semiconductor package with heat dissipation devices
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| 40 |
8,310,044 |
Semiconductor device and method of manufacturing the same
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| 41 |
8,304,902 |
Semiconductor device
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| 42 |
8,299,608 |
Enhanced thermal management of 3-D stacked die packaging
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| 43 |
8,299,606 |
Semiconductor device includes a ceramic substrate and heat sink
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| 44 |
8,299,599 |
Semiconductor device
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| 45 |
8,288,862 |
Multiple die stack package
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| 46 |
8,284,556 |
Electronic substrate device
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| 47 |
8,283,776 |
Microfabricated pillar fins for thermal management
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| 48 |
8,279,606 |
Processor loading system including a heat dissipater
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| 49 |
8,278,154 |
Method of fabricating a semiconductor device package including a heat
radiation plate
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| 50 |
RE43,663 |
Semiconductor device
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