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| 1 |
8,187,055 |
Polishing apparatus and polishing method
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| 2 |
8,087,975 |
Composite sheet for mounting a workpiece and the method for making the
same
|
| 3 |
8,038,508 |
Apparatus for polishing a wafer and method for detecting a polishing end
point by the same
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| 4 |
7,976,361 |
Polishing apparatus and polishing method
|
| 5 |
7,901,270 |
Method and apparatus for precision polishing of optical components
|
| 6 |
7,862,402 |
Polishing apparatus and substrate processing apparatus
|
| 7 |
7,815,492 |
Surface treatment method
|
| 8 |
7,682,225 |
Polishing apparatus and substrate processing apparatus
|
| 9 |
7,662,024 |
Method and apparatus for precision polishing of optical components
|
| 10 |
7,621,799 |
Polishing method and polishing device
|
| 11 |
7,438,632 |
Method and apparatus for cleaning a web-based chemical mechanical
planarization system
|
| 12 |
7,431,634 |
Platen assembly, apparatus having the platen assembly and method of
polishing a wafer using the platen assembly
|
| 13 |
7,371,158 |
Plating removing apparatus for two-piece wheel
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| 14 |
7,303,467 |
Chemical mechanical polishing apparatus with rotating belt
|
| 15 |
7,278,905 |
Apparatus and method for conditioning polishing surface, and polishing
apparatus and method of operation
|
| 16 |
7,241,204 |
Polishing pad, method of producing same and method of polishing
|
| 17 |
7,179,154 |
Method and apparatus for cleaning a wafer bevel edge and notch using a pin
and an abrasive film cassette
|
| 18 |
7,153,182 |
System and method for in situ characterization and maintenance of
polishing pad smoothness in chemical mechanical polishing
|
| 19 |
7,144,304 |
Method and apparatus for planarizing a microelectronic substrate with a
tilted planarizing surface
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| 20 |
7,115,023 |
Process tape for cleaning or processing the edge of a semiconductor wafer
|
| 21 |
7,115,021 |
Abrasive, method of polishing target member and process for producing
semiconductor device
|
| 22 |
7,104,875 |
Chemical mechanical polishing apparatus with rotating belt
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| 23 |
7,090,560 |
System and method for detecting abrasive article orientation
|
| 24 |
7,063,607 |
Bowling ball resurfacing apparatus
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| 25 |
7,044,837 |
Magnetic head cleaning method
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| 26 |
7,029,369 |
End-point detection apparatus
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| 27 |
7,018,276 |
Air platen for leading edge and trailing edge control
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| 28 |
6,991,512 |
Apparatus for edge polishing uniformity control
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| 29 |
6,971,950 |
Polishing silicon wafers
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| 30 |
6,955,588 |
Method of and platen for controlling removal rate characteristics in
chemical mechanical planarization
|
| 31 |
6,926,589 |
Chemical mechanical polishing apparatus and methods using a flexible pad
and variable fluid flow for variable polishing
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| 32 |
6,908,369 |
Apparatus for and method of smoothing substrate surface
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| 33 |
6,899,594 |
Relative lateral motion in linear CMP
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| 34 |
6,896,600 |
Liquid dispense manifold for chemical-mechanical polisher
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| 35 |
6,893,329 |
Polishing apparatus with abrasive tape, polishing method using abrasive
tape and manufacturing method for magnetic disk
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| 36 |
6,875,085 |
Polishing system including a hydrostatic fluid bearing support
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| 37 |
6,843,706 |
Polishing apparatus
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| 38 |
6,837,779 |
Chemical mechanical polisher with grooved belt
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| 39 |
6,837,774 |
Linear chemical mechanical polishing apparatus equipped with programmable
pneumatic support platen and method of using
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| 40 |
6,790,128 |
Fluid conserving platen for optimizing edge polishing
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| 41 |
6,786,810 |
Abrasive article having a window system for polishing wafers, and methods
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| 42 |
6,782,717 |
Method for manufacturing glass substrate of information recording medium
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| 43 |
6,761,626 |
Air platen for leading edge and trailing edge control
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| 44 |
6,755,723 |
Polishing head assembly
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| 45 |
6,749,489 |
Method and apparatus for planarizing and cleaning microelectronic
substrates
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| 46 |
6,746,320 |
Linear reciprocating disposable belt polishing method and apparatus
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| 47 |
6,736,714 |
Polishing silicon wafers
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| 48 |
6,736,710 |
Polisher for polishing end surface of semiconductor wafer
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| 49 |
6,729,945 |
Apparatus for controlling leading edge and trailing edge polishing
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| 50 |
6,712,679 |
Platen assembly having a topographically altered platen surface
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