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| 1 |
8,193,084 |
Method of manufacturing semiconductor device
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| 2 |
8,088,656 |
Fabricating ESD devices using MOSFET and LDMOS
|
| 3 |
8,085,964 |
Apparatus and methods for generating pressure waves
|
| 4 |
8,034,648 |
Epitaxial regrowth in a distributed feedback laser
|
| 5 |
8,026,150 |
Semiconductor device manufacturing method and storage medium
|
| 6 |
8,021,988 |
Method of forming semiconductor device and semiconductor device
|
| 7 |
8,012,773 |
Method for manufacturing liquid discharge head
|
| 8 |
8,008,184 |
Semiconductor device manufacturing method, semiconductor manufacturing
apparatus and storage medium
|
| 9 |
8,003,482 |
Methods of processing semiconductor substrates in forming scribe line
alignment marks
|
| 10 |
7,998,775 |
Silicon undercut prevention in sacrificial oxide release process and
resulting MEMS structures
|
| 11 |
7,994,041 |
Method of manufacturing stacked semiconductor package using improved
technique of forming through via
|
| 12 |
7,989,824 |
Method of forming a dielectric layer on a semiconductor light emitting
device
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| 13 |
7,989,323 |
Doping method
|
| 14 |
7,989,316 |
Method of manufacturing semiconductor device
|
| 15 |
7,989,315 |
Method for manufacturing semiconductor device
|
| 16 |
7,985,647 |
Method of manufacturing nonvolatile memory device
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| 17 |
7,985,636 |
Method for fabricating low temperature poly-silicon thin film transistor
substrate
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| 18 |
7,981,800 |
Shallow trench isolation structures and methods for forming the same
|
| 19 |
7,981,749 |
MOS structures that exhibit lower contact resistance and methods for
fabricating the same
|
| 20 |
7,977,741 |
Manufacturing method of flexible semiconductor device and flexible
semiconductor device
|
| 21 |
7,977,241 |
Method for fabricating highly reliable interconnects
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| 22 |
7,977,139 |
Method for manufacturing CIS based thin film solar cell device
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| 23 |
7,972,940 |
Wafer processing
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| 24 |
7,972,880 |
Method for fabricating a liquid crystal display device and an LCD device
thereby
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| 25 |
7,968,382 |
Method of manufacturing semiconductor device
|
| 26 |
7,964,463 |
Method for fabricating semiconductor device including vertical channel
transistor
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| 27 |
7,964,456 |
Method of fabricating polysilicon thin film and thin film transistor using
polysilicon fabricated by the same method
|
| 28 |
7,960,208 |
Wafer level hermetic bond using metal alloy with raised feature
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| 29 |
7,955,885 |
Methods of forming packaged micro-electromechanical devices
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| 30 |
7,955,874 |
Method of producing bonded silicon wafer
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| 31 |
7,955,872 |
Manufacturing method of semiconductor integrated circuit device using
magnetic memory
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| 32 |
7,947,527 |
Method for metallization of a semiconductor device
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| 33 |
7,939,427 |
Process for fabricating a substrate of the silicon-on-insulator type with
reduced roughness and uniform thickness
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| 34 |
7,935,583 |
Fabrication method of pixel structure
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| 35 |
7,927,916 |
Optic wafer with reliefs, wafer assembly including same and methods of
dicing wafer assembly
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| 36 |
7,927,888 |
Method to fabricate a chip for the detection of biological elements
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| 37 |
7,923,837 |
Microelectronic device patterned by ablating and subsequently sintering
said microelectronic device
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| 38 |
7,923,319 |
Method for manufacturing a semiconductor integrated circuit device circuit
device
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| 39 |
7,923,290 |
Integrated circuit packaging system having dual sided connection and
method of manufacture thereof
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| 40 |
7,919,857 |
Plastic housing and semiconductor component with said plastic housing
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| 41 |
7,919,334 |
MRAM
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| 42 |
7,915,121 |
Method for manufacturing semiconductor device having buried gate
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| 43 |
7,915,087 |
Method of arranging dies in a wafer for easy inkless partial wafer process
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| 44 |
7,915,080 |
Bonding IC die to TSV wafers
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| 45 |
7,906,797 |
Organic material photodiode
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| 46 |
7,902,661 |
Integrated circuit micro-module
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| 47 |
7,901,999 |
FPGA equivalent input and output grid muxing on structural ASIC memory
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| 48 |
7,901,984 |
Integrated circuit micro-module
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| 49 |
7,901,981 |
Integrated circuit micro-module
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| 50 |
7,901,973 |
Solid state imaging device and manufacturing method thereof
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