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| 1 |
6,939,741 |
IC chip manufacturing method
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| 2 |
6,890,402 |
Substrate holding apparatus and substrate polishing apparatus
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| 3 |
6,719,874 |
Active retaining ring support
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| 4 |
6,594,542 |
Method and system for controlling chemical mechanical polishing thickness
removal
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| 5 |
6,585,850 |
Retaining ring with a three-layer structure
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| 6 |
6,530,829 |
CMP pad having isolated pockets of continuous porosity and a method for
using such pad
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| 7 |
6,447,380 |
Polishing apparatus and substrate retainer ring providing continuous slurry
distribution
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| 8 |
6,432,258 |
Apparatus for and method of polishing workpiece
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| 9 |
6,406,362 |
Seal for use with a chemical mechanical planarization apparatus
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| 10 |
RE37,622 |
Wafer polishing method and apparatus
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| 11 |
6,338,672 |
Dressing wheel system
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| 12 |
6,218,306 |
Method of chemical mechanical polishing a metal layer
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| 13 |
6,165,058 |
Carrier head for chemical mechanical polishing
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| 14 |
6,146,260 |
Polishing machine
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| 15 |
6,110,008 |
Polishing system
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| 16 |
6,089,965 |
Polishing pad
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| 17 |
6,033,520 |
Apparatus for and method of polishing workpiece
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| 18 |
6,007,409 |
Sample holder for parallel lapping tool and method of using
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| 19 |
5,860,853 |
Apparatus for polishing wafers
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| 20 |
5,836,806 |
Slurries for chemical mechanical polishing
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| 21 |
5,749,769 |
Lapping process using micro-advancement for optimizing flatness of a
magnetic head air bearing surface
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| 22 |
5,720,845 |
Wafer polisher head used for chemical-mechanical polishing and endpoint
detection
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| 23 |
5,643,061 |
Pneumatic polishing head for CMP apparatus
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| 24 |
5,643,048 |
Endpoint regulator and method for regulating a change in wafer thickness
in chemical-mechanical planarization of semiconductor wafers
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| 25 |
5,573,448 |
Method of polishing wafers, a backing pad used therein, and method of
making the backing pad
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| 26 |
5,498,196 |
Wafer polishing method and apparatus
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| 27 |
5,433,650 |
Method for polishing a substrate
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| 28 |
5,409,770 |
Elastic foamed sheet and wafer-polishing jig using the sheet
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| 29 |
5,361,545 |
Polishing machine
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| 30 |
5,191,738 |
Method of polishing semiconductor wafer
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| 31 |
5,174,067 |
Automatic wafer lapping apparatus
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| 32 |
5,159,787 |
Method for lapping two surfaces of a titanium disk
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| 33 |
5,154,023 |
Polishing process for refractory materials
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| 34 |
5,109,631 |
Finish-machining machine comprising means for feeding an abrasive slurry
at a controlled rate
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| 35 |
4,918,870 |
Floating subcarriers for wafer polishing apparatus
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| 36 |
4,897,966 |
Polishing apparatus
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| 37 |
4,780,991 |
Mask and pressure block for ultra thin work pieces
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| 38 |
4,773,185 |
Surface abrading machine
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| 39 |
4,707,948 |
Float lapping fixture
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| 40 |
4,519,168 |
Liquid waxless fixturing of microsize wafers
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| 41 |
4,459,781 |
Grinding and polishing apparatus
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| 42 |
4,321,772 |
Levelable lapping machine
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| 43 |
4,319,432 |
Polishing fixture
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| 44 |
4,149,343 |
Surface-grinding method and apparatus
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| 45 |
4,132,037 |
Apparatus for polishing semiconductor wafers
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| 46 |
4,062,658 |
Composition and method for repairing selenium photoreceptors
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| 47 |
4,043,081 |
Dry lap polisher
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| 48 |
4,020,600 |
Polishing fixture
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| 49 |
4,009,539 |
Lapping machine with vacuum workholder
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| 50 |
3,978,621 |
Machine for surface-, plane-parallel-, and plain lapping
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